Manuscript Deadline: April 23, 2021
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TS5. Thin Films on Polymer Substrates: Flexible Electronics and Beyond

Topical Symposium 5

This session focuses on all aspects of material science related to thin films and coatings deposited on polymer substrates as well as metal-polymer and ceramic-polymer composite materials in general. Both fundamental and applied contributions on the following topics are highly welcome:

  • Thin films for flexible electronics applications (conductive, semiconducting, magnetic, barrier layers, encapsulation, etc.)
  • Additive manufacturing and other novel methods for thin film fabrication
  • Atomic layer (ALD) and molecular layer deposition (MLD)
  • Fabrication and properties of metal-polymer / ceramic-polymer composites and interfaces
  • 3D printing of metal-polymer composites
  • Functional and mechanical properties of novel alloys deposited on polymer substrates (high-entropy alloys, metallic glasses, etc.)
  • Flexible and stretchable electronic devices
TS5. Invited Speakers:
  • Denys Makarov, Helmholtz-Zentrum Dresden-Rossendorf e. V. (HZDR), Institute of Ion Beam Physics and Materials Research, Germany, “Flexible Electronics: From Interactive Smart Skins to In vivo Applications”
  • Tina Ng, University of California San Diego, USA, “Printed Flexible Electronics for Biomechanical Measurements”

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Key Dates

Late News Abstract Deadline:
February 5, 2021

Presenter Registration Deadline:
March 1, 2021

Manuscript Deadline:
April 23, 2021

Attendee Registration Deadline:
April 30, 2021

Abstract & Awards Deadline:
October 1, 2021

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ICMCTF
Yvonne Towse

Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
icmctf@icmctf.org

 

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